Liquid epoxy resin composition and semiconductor device

Details Liquid epoxy resin composition and semiconductor device Liquid epoxy resin composition and semiconductor device

2007-01-30

2007-01-30

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

C523S445000, C523S457000, C523S466000, C525S476000, C525S523000

Reexamination Certificate

active

10808329

ABSTRACT:
A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising 5–100% by weight of a specific aromatic amine compound having a purity of at least 99%, (C) an inorganic filler, and (D) an ester organic solvent having a boiling point of 130–250° C. is useful for semiconductor encapsulation. The composition has an infiltration ability, adhesion to silicon chips, resistance to deterioration under hot humid conditions, and resistance to thermal shocks.

REFERENCES:
patent: 5371279 (1994-12-01), Qi et al.
patent: 5840417 (1998-11-01), Bolger
patent: 60012318 (1985-04-01), None
patent: 05140267 (1993-06-01), None
patent: 09176294 (1997-07-01), None
patent: 10-158365 (1998-06-01), None
patent: 10-158366 (1998-06-01), None
patent: 10158366 (1998-06-01), None
patent: 2002121259 (2002-04-01), None
Translation of Japanese Patent No. 2002-121259, Katsurayama, Apr. 23, 2002, p. 5, paragraph [0017], one page.

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