Liquid epoxy resin composition and semiconductor device

Details Liquid epoxy resin composition and semiconductor device Liquid epoxy resin composition and semiconductor device

2006-08-22

2006-08-22

Sellers, Robert (Department: 1712)

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Mixing of two or more solid polymers; mixing of solid...

C523S428000, C523S445000, C523S457000, C523S466000, C525S474000, C525S476000, C525S486000, C525S507000, C525S523000, C525S524000

Reexamination Certificate

active

07094844

ABSTRACT:
A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

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