Liquid epoxy resin composition

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...

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523443, 523444, 523466, 523434, C08K 334, C08K 336, C08L 6300

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active

056166338

ABSTRACT:
The present invention provides a liquid epoxy resin composition that includes an epoxy resin, at least one filler and an inorganic thixotropic agent in an amount effective to reduce settling of said filler at ambient temperatures. The composition further includes a polymer powder that dissolves in and thickens the composition when the composition is heated. The polymer powder is added in an amount effective to reduce settling of said filler at temperatures up to the gelling temperature of the composition. The thixotropic agent is added in an amount that the resulting epoxy resin composition is a free-flowing liquid. The composition may optionally further include a curing agent.

REFERENCES:
patent: 3746662 (1973-07-01), Adelman
patent: 3843675 (1974-10-01), Porret
patent: 4569956 (1986-02-01), Breitigan
patent: 5064585 (1991-11-01), Cooper
patent: 5112889 (1992-05-01), Ueji
patent: 5368922 (1994-11-01), Portelli
Lee, et al., "Handbook or Epoxy Resns", McGrawHill Book Co., New York, pp. 14/4-9, (1982 & Reissue).
Derwent Abst. 91-129195, [18], JP 03-068,673.
Abst. for JP 60155224.
Abst. for JP 61197624.
Abst. for JP 61088404.
H. Lee & K. Neville (Handbook of Epoxy Resins pp. 15-34, (1982 Reissue).
H. Lee & K. Neville (Handbook of Epoxy Resins) pp. 14-4 to 9 (1982 Reissue.
Encyl. Pol. Sci & Eng. H. Mark et al. ed., vol. 14, John Wiley & Sons pp. 459-462 (1988).

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