Liquid epoxy molding system

Details Liquid epoxy molding system Liquid epoxy molding system

1980-02-19

1981-09-29

Czaja, Donald E.

Plastic and nonmetallic article shaping or treating: processes

Disparate treatment of article subsequent to working,...

Effecting temperature change

260 37EP, 2643282, 2643286, B29C 2500

Patent

active

042922682

ABSTRACT:
Injection molding of liquid epoxy resins is facilitated by adding an organic acid plus a siliceous filler to the curable epoxy resin system which thickens and thereby precludes leaking of resin from the mold.

REFERENCES:
patent: 2548447 (1951-04-01), Shokal et al.
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patent: 3073786 (1963-01-01), Kraft et al.
patent: 3117099 (1964-01-01), Proops et al.
patent: 3929716 (1975-12-01), Komoto et al.
patent: 3963796 (1976-06-01), Yokono et al.
patent: 4009141 (1977-02-01), Nichols et al.
patent: 4142416 (1979-03-01), Smith et al.

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