Liquid encapsulated integrated circuit package

Details Liquid encapsulated integrated circuit package Liquid encapsulated integrated circuit package

1974-04-19

1976-12-21

Tolin, Gerald P.

Geometrical instruments

317101D, 339 17CF, 174 16HS, H05K 720

Patent

active

039991059

ABSTRACT:
A liquid encapsulated high density integrated circuit package which serves as a complete computer basic system module having both logic and memory circuits in the same package. This unit takes advantage of improvements in the integrated circuit art to minimize the number of physical units required to provide the desired memory capacity while simultaneously maximizing density and thereby minimizing signal path length. Basically the package contains a plurality of stacked semiconductor wafers each of which provides either integrated memory or logic functions. Each semiconductor wafer is mounted on an insulated wafer carrier and is connected to stacking pins around the perimeter of the carrier via a series of radial interconnection which are flexible expansion leads disposed around the outer edge of the wafer. Each wafer is floatation mounted by attaching only its center to the carrier to minimize the stress effects of a thermal expansion mismatch between the wafer, the carrier, and the radial interconnections.
The carrier on which the wafer is mounted is constructed to mechanically secure and support the wafer at its physical center, to provide electrical contact to the wafer substrate, to provide support of electrical stacking pins which connect with stacking pins on adjacent carriers, to provide support for the radial interconnection expansion leads extending between pads on the wafer and the stacking pins and to minimize the effects of thermal mismatch in the structure.
A finned housing encloses the stacked wafers and carriers and is hermetically sealed to a header having feed through termination pin such that the package can contain a liquid coolant which aids in the transfer of heat between the wafers and the finned housing thus maximizing the dissipation of heat from the wafers.

REFERENCES:
patent: 2205502 (1940-06-01), Tromp
patent: 2978612 (1961-04-01), Lutton
patent: 3316458 (1967-04-01), Jenny
patent: 3340491 (1967-09-01), Deakin
patent: 3411049 (1968-11-01), Trincossi
patent: 3417814 (1968-12-01), Oktay
patent: 3487350 (1969-12-01), Hammell
patent: 3495131 (1970-02-01), Melcher
patent: 3634879 (1972-01-01), Longenecker
patent: 3686533 (1972-08-01), Garnier
patent: 3741292 (1973-06-01), Aakalu
patent: 3764856 (1973-10-01), Martin
patent: 3774078 (1973-11-01), Martin
patent: 3823771 (1974-07-01), Ludwig
patent: 3851221 (1974-11-01), Beaulieu

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