Liquid drop discharge head and manufacture method thereof,...

Details Liquid drop discharge head and manufacture method thereof,... Liquid drop discharge head and manufacture method thereof,...

2006-06-19

2010-06-08

Alanko, Anita K (Department: 1792)

Etching a substrate: processes

Forming or treating thermal ink jet article

C216S052000, C216S053000, C216S083000, C216S084000, C216S099000, C438S021000, C029S890100

Reexamination Certificate

active

07731861

ABSTRACT:
A liquid drop discharge head includes a chip21that is formed by separation of a silicon wafer20. The silicon wafer20has a first direction and a second direction which are mutually intersected. The chip21is separated from the silicon wafer20by etching the wafer along a separation line22parallel to the first direction of the wafer and by dicing the wafer20along a separation line23parallel to the second direction of the wafer.

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