Liquid dispersion for enhancing the electroplating of a non-cond

Details Liquid dispersion for enhancing the electroplating of a non-cond Liquid dispersion for enhancing the electroplating of a non-cond

1990-07-23

1992-04-21

Barr, Josephine

Compositions

Electrically conductive or emissive compositions

Elemental carbon containing

252509, 252510, 252511, 106472, 106478, 106 105, 106 111, H01B 100, H01B 106, B22F 700

Patent

active

051065371

ABSTRACT:
Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps:

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patent: 4964959 (1990-10-01), Nelsen et al.

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