Liquid dispense head and manufacturing method thereof

Details Liquid dispense head and manufacturing method thereof Liquid dispense head and manufacturing method thereof

2007-07-10

2007-07-10

Ganey, Steven J. (Department: 3752)

Fluid sprinkling, spraying, and diffusing

With means to vibrate or jiggle discharge

By electric transducer

C239S102100, C239S552000, C239S566000, C239S596000, C347S047000, C347S070000, C347S085000

Reexamination Certificate

active

10827617

ABSTRACT:
A liquid dispense head is provided which can be manufactured at a reduced manufacturing cost, will not react with dispense liquid containing biomolecules, and can dispense liquid droplets having a constant amount from individual nozzles. The liquid dispense head has reservoirs used as reservoirs for containing liquid, pressure chambers for applying a pressure to dispense the liquid, flow passages connecting the pressure chambers and the respective reservoirs. In the liquid dispense head described above, a part of the flow passage is formed of a minute through-hole provided in a glass substrate, and the inside diameter of the minute through-hole is continuously decreased or increased.

REFERENCES:
patent: 3900162 (1975-08-01), Titus et al.
patent: 6491969 (2002-12-01), Eldridge
patent: 6502921 (2003-01-01), Kanda et al.
patent: 6568799 (2003-05-01), Yang et al.
patent: 6722582 (2004-04-01), Hess et al.
patent: 2003/0016270 (2003-01-01), Kubota et al.
patent: 2001-001548 (2001-01-01), None
patent: 2001-270114 (2001-10-01), None
patent: 2002-286735 (2002-10-01), None
patent: 2003-231251 (2003-08-01), None

Affiliated with

Also associated with

Rating

Liquid dispense head and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid dispense head and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid dispense head and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3751093