Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2006-05-19
2009-08-25
Vinh, Lan (Department: 1792)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S080000, C216S099000, C347S047000
Reexamination Certificate
active
07578943
ABSTRACT:
A loss in the rigidity of a substrate for a liquid discharge head having nozzles at a high density can be suppressed. A liquid discharge head includes plural pressure generating chambers respectively provided with pressure generating elements, plural nozzle apertures respectively communicating with the plural pressure generating chambers and adapted to discharge a liquid, and a reservoir with which the plural pressure generating chambers commonly communicate respectively through communicating parts. The pressure generating chambers and the reservoir respectively have recessed portions formed respectively on one and the other of two principal planes of the same substrate, and the reservoir contains a portion shallower than a portion within the reservoir that communicates with the pressure generating chambers.
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Kurashima Rei
Nakanishi Koichiro
Ushijima Takashi
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
Vinh Lan
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