Liquid crystal polymer encapsulated electronic devices and metho

Details Liquid crystal polymer encapsulated electronic devices and metho Liquid crystal polymer encapsulated electronic devices and metho

1993-04-12

1995-01-17

Picard, Leo P.

Metal working

Method of mechanical manufacture

Electrical device making

174 522, 257787, H01R 4300

Patent

active

053815998

ABSTRACT:
Disclosed is a high temperature, high pressure process of encapsulating electronic devices. The high pressure process is particularly suitable for encapsulating flip-chip devices wherein the collapse of flip-chip solder bumps is prevented. A special mold may be used to prevent the ceramic substrate of the flip-chip device from breaking under the high injection pressure conditions. The encapsulant is a rigid liquid crystal polymer.

REFERENCES:
patent: 4139399 (1979-02-01), Lindmayer
patent: 4480975 (1984-11-01), Plummer et al.
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4701830 (1987-10-01), Kato
patent: 4756392 (1988-05-01), Hoppe
patent: 4788583 (1988-11-01), Kawahara et al.
patent: 4925266 (1990-05-01), Huebscher et al.
patent: 4965227 (1990-10-01), Chang et al.
patent: 4983713 (1991-01-01), Hayashi et al.
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5085913 (1992-02-01), Wong
patent: 5087479 (1992-02-01), McManus et al.
patent: 5186383 (1993-02-01), Melton et al.
patent: 5219502 (1993-06-01), Zaidi et al.
patent: 5219795 (1993-06-01), Kumai et al.
patent: 5223344 (1993-06-01), Sumpter et al.
patent: 5251679 (1993-10-01), Schweizer
IBM Technical Disclosure R. R. Dion and J. A. Benenati vol. 7, No. 7, Dec. 1964.
IBM Technical Disclosure R. W. Nufer vol. 16 No. 9 Feb. 1974.

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