Metal fusion bonding – Process – Critical work component – temperature – or pressure
Patent
1980-07-10
1981-08-11
Bauer, Edward S.
Metal fusion bonding
Process
Critical work component, temperature, or pressure
350343, 357 71, 228121, 228263R, G02F 1133
Patent
active
042831180
ABSTRACT:
A liquid crystal display includes a substrate carrying display electrodes and an integrated circuit chip connected thereto. The display electrodes are made of appropriate transparent material such as InO.sub.2. Multiple soldering layers are provided on the extension of the display electrodes so that they are bonded with bumps formed on the integrated circuit chip by soldering technology. The multiple soldering layers are deposited by evaporation methods or sputtering techniques with a thickness of 3000 A to 5000 A. In a preferable form, the multiple soldering layers include three (3) layers made of Cr, Cr-Au alloy, Au, respectively. The multiple soldering layers may comprise two (2) layers made of Ni-Fe alloy and Au in another preferable form.
REFERENCES:
patent: 3928658 (1975-12-01), van Bortel
patent: 4106860 (1978-08-01), Kaufmann
Bauer Edward S.
Sharp Kabushiki Kaisha
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