Liquid crystal cells – elements and systems – Nominal manufacturing methods or post manufacturing...
Reexamination Certificate
2005-04-26
2005-04-26
Chowdhury, Tarifur R. (Department: 2871)
Liquid crystal cells, elements and systems
Nominal manufacturing methods or post manufacturing...
Reexamination Certificate
active
06885426
ABSTRACT:
In the manufacturing step of performing thermal compression bonding with respect to a driving integrated circuit and a glass substrate included in a liquid crystal panel so as to connect an electrode of the driving integrated circuit and an electrode of the glass substrate by using an anisotropic conductive adhesive in which conductive particles are diffused in an insulative adhesive, the anisotropic conductive adhesive includes conductive particles, a resin a whose average molecular weight is in a range of from 10000 to 100000, a resin b whose average molecular weight is of not more than 1000, a stress relaxation resin, and a curing agent; and a Young's modulus of the anisotropic conductive adhesive after curing is in a range of from 1.4 Gpa to 1.6 Gpa.
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NB 9112341 IBM Technical disclosure Bulletin, Dec. 1991, US vol. 34, 7B, PP 341-342.
Inada Kiyoshi
Matsui Takashi
Shiota Motoji
Akkapeddi P. R.
Birch & Stewart Kolasch & Birch, LLP
Chowdhury Tarifur R.
Sharp Kabushiki Kaisha
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