Liquid crystal device with driver element thicker than a first s

Details Liquid crystal device with driver element thicker than a first s Liquid crystal device with driver element thicker than a first s

1997-03-06

1998-12-08

Gross, Anita Pellman

Liquid crystal cells, elements and systems

Particular structure

Having significant detail of cell structure only

349149, 349187, G02F 11345, G02F 113

Patent

active

058477969

ABSTRACT:
A driving IC is face-down bonded to a substrate. The thickness T of the driving IC is greater than the thickness t of an opposing substrate of a liquid crystal panel and an upper surface of the driving IC is made higher than an upper surface of the opposing substrate. The upper surface of the driving IC is heated and pressed by a bonding tool to bond bumps of the driving IC to interconnecting lines and bond the driving IC to the substrate with an adhesive. It is thus possible to sufficiently heat and press the driving IC without contact between the bonding tool and the opposing substrate, thereby permitting bonding with high reliability.

REFERENCES:
patent: 4008564 (1977-02-01), Luce et al.
patent: 4145120 (1979-03-01), Kubota
patent: 4643526 (1987-02-01), Watanabe et al.
patent: 4826297 (1989-05-01), Kubo et al.
patent: 5606440 (1997-02-01), Kawaguchi et al.
patent: 5726726 (1998-03-01), Nakanishi
patent: 5748267 (1998-05-01), Natori et al.

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