Liquid cooling type high frequency solid state device

Details Liquid cooling type high frequency solid state device Liquid cooling type high frequency solid state device

1987-08-20

1989-01-03

Davis, Jr., Albert W.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

16510433, 357 82, H01L 2344

Patent

active

047961554

ABSTRACT:
A liquid cooling type high frequency solid state device comprising: a solid state chip; at least one matching circuit connected to the solid state chip; a carrier for mounting the solid state chip and the matching circuit, constituting a solid state circuit to be cooled; a coolant vessel for containing a liquid coolant, with a space for coolant vapor at the top thereof; and an element for condensing the coolant vapor contained in the top space of the vessel. At least a part of the solid state circuit contacts the liquid coolant for boiling and evaporating the coolant. Amplitude modulation of the solid state circuit due to the boiling of the coolant is prevented.

REFERENCES:
patent: 3270250 (1966-08-01), Davis
patent: 3489207 (1970-01-01), Miller
patent: 3972063 (1976-07-01), Kimura et al.
patent: 4468717 (1984-08-01), Mathias
Horowitz, P. et al, The Art of Electronics, Cambridge Press, Cambridge , NJ, 1981, pp. 565, 580, 581.
Ronkese, B. J., Heat Sink, IBM Technical Disclosure Bulletin, vol. 20, No. 9, 2/1978, pp. 3577-3578.

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