Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2002-04-30
2004-06-15
Flanigan, Allen (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C165S122000, C361S699000
Reexamination Certificate
active
06749012
ABSTRACT:
BACKGROUND
This invention relates generally to processor-based systems and, particularly, to liquid cooling of processor-based systems.
Processor performance is directly related to the temperature of the processor. A variety of air and liquid cooling techniques are known to decrease processor temperature. Liquid cooling techniques generally allow greater cooling efficiency, but have a number of drawbacks.
Liquid cooling techniques may take up too much of the available size inside the housing of the processor-based system. In addition, they tend to be more expensive. Liquid cooling techniques also may be prone to leakage, and leakage would adversely affect the operation of most electrical components within the processor-based system.
Thus, there is a need for better ways to provide liquid cooling for processor-based systems.
REFERENCES:
patent: 3481393 (1969-12-01), Chu
patent: 3817321 (1974-06-01), Von Cube et al.
patent: 4706739 (1987-11-01), Noren
patent: 5014904 (1991-05-01), Morton
patent: 5043797 (1991-08-01), Lopes
patent: 5052472 (1991-10-01), Takahashi et al.
patent: 5323847 (1994-06-01), Koizumi et al.
patent: 6064570 (2000-05-01), Wang et al.
patent: 6148860 (2000-11-01), Sigler
patent: 6351381 (2002-02-01), Bilski et al.
patent: 6447270 (2002-09-01), Schmidt et al.
patent: 2003/0056939 (2003-03-01), Chu et al.
Gwin Paul J.
Konstad Rolf A.
Flanigan Allen
Intel Corporation
Trop Pruner & Hu P.C.
LandOfFree
Liquid cooling system for processors does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Liquid cooling system for processors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid cooling system for processors will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3337168