Liquid cooling system

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S701000, C361S712000, C257S930000, C257SE23082, C062S003200

Reexamination Certificate

active

10715322

ABSTRACT:
Liquid cooling systems and apparatus are presented. A number of embodiments are presented. In each embodiment, a heat transfer system capable of engaging a processor and adapted to transfer heat from the processor is implemented. A variety of embodiments of the heat transfer system are presented. For example, several embodiments of a heat transfer system including electron-conducting material is presented. In one embodiment of the present invention, the electron conducting material operates under the peltier principal.

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patent: 6705089 (2004-03-01), Chu et al.
patent: 6711904 (2004-03-01), Law et al.
patent: 7022553 (2006-04-01), Ahn et al.

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