Liquid cooling system

Details Liquid cooling system Liquid cooling system

2011-03-15

2011-03-15

Hoffberg, Robert J (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S679470, C361S679540, C361S699000, C361S704000, C361S716000, C361S721000, C165S080400, C165S104330, C165S185000

Reexamination Certificate

active

07907398

ABSTRACT:
A liquid cooling system includes a board and a plurality of heat producing components (HPCs) coupled to the board. A mounting structure is located on the board adjacent to the plurality of HPCs. A liquid cooling device is coupled to the mounting structure such that the liquid cooling device engages each of the plurality of HPCs. The liquid cooling device may be decoupled from the mounting structure without detaching liquid conduits that supply it liquid in order to allow for the addition or removal of HPCs.

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