Liquid-cooling module system for electronic circuit components

Details Liquid-cooling module system for electronic circuit components Liquid-cooling module system for electronic circuit components

1988-09-29

1991-09-17

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 357 79, 357 82, 361386, H05N 720

Patent

active

050500376

ABSTRACT:
A printed circuit board assembly having a printed circuit board mounted, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compressive contact with the electronic circuit components on both faces of the printed circuit board.

REFERENCES:
patent: 3389305 (1968-06-01), Bond
patent: 3649738 (1972-03-01), Andersson et al.
patent: 3921201 (1975-11-01), Eisele et al.
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4156458 (1979-05-01), Chu et al.
patent: 4341432 (1982-07-01), Cutchaw
patent: 4536824 (1985-08-01), Barrett et al.
A. L. Pascuzzo et al., "Integrated Circuit Module Package Cooling Structure", IBM Technical Disclosure Bulletin, vol. 20, No. 10, 3/78, pp. 3898-3899.

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