Liquid cooling device for a high-power semiconductor module

Details Liquid cooling device for a high-power semiconductor module Liquid cooling device for a high-power semiconductor module

1997-10-21

1999-11-02

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361677, 361689, 361703, 165 804, H05K 720

Patent

active

059782200

ABSTRACT:
In a liquid cooling device (1) for a high-power semiconductor module (14), which contains a plurality of heat-generating submodules (8a-h) arranged next to one another on a cooling surface (3) and is fusion-bonded to the cooling surface (3), an improved load cycle resistance is achieved by the liquid cooling device (1) having a housing (2) which encloses a liquid space (4), through which a cooling liquid flows, and the upper side of which forms the cooling surface (3), and by the housing (2) of the liquid cooling device (1), at least in the region of the cooling surface (3), consisting of a metal-ceramic composite material, the coefficient of thermal expansion of which is adapted to the coefficient of thermal expansion of the ceramic substrates or of the power semiconductor devices of the submodules (8a-h) and, by additional means (11a-h; 12) for improving the heat transfer between the cooling surface (3) and the cooling liquid being provided in the liquid space (4) of the liquid cooling device (1).

REFERENCES:
patent: 4652970 (1987-03-01), Watari et al.
patent: 4724611 (1988-02-01), Hagihara
patent: 4765400 (1988-08-01), Chu et al.
patent: 5316075 (1994-05-01), Quon et al.
patent: 5349498 (1994-09-01), Tanzer et al.

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