Liquid cooled power electronic circuit comprising stacked...

Details Liquid cooled power electronic circuit comprising stacked... Liquid cooled power electronic circuit comprising stacked...

2007-05-03

2009-10-27

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23098, C257SE25013, C257S728000, C257S686000, C257S777000, C257S723000, C257S712000, C257S713000, C257S717000, C257S720000, C257S675000

Reexamination Certificate

active

07608924

ABSTRACT:
A plurality of direct die cooled semiconductor power device packages are vertically stacked with both coolant and electrical interfacing to form a liquid cooled power electronic circuit. The packages are individually identical, and selectively oriented prior to stacking in order to form the desired circuit connections and laterally stagger the package leads.

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patent: 2006/0291164 (2006-12-01), Myers et al.
patent: 2007/0063337 (2007-03-01), Schubert et al.
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patent: 1 708 322 (2006-10-01), None
patent: 2006/056199 (2006-06-01), None
European Search Report dated Oct. 29, 2008.

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