Liquid cooled multi-chip integrated circuit module incorporating

Details Liquid cooled multi-chip integrated circuit module incorporating Liquid cooled multi-chip integrated circuit module incorporating

1988-10-31

1989-11-07

Envall Jr., Roy N.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

H01L 2336, H01L 2340

Patent

active

048796298

ABSTRACT:
A liquid cooled integrated circuit module includes a substrate, a plurality of chips mounted on the substrate, and electrical conductors integrated into the substrate to interconnect the chips. A compliant member which is completely seamless overlies all of the chips. This seamless compliant member is hermetically sealed at its perimeter to the substrate around all of the chips. Between this seamless compliant member and the chips are thermally conductive studs, and they carry heat by conduction from the chips to the compliant member. A rigid cover overlies the compliant member, and it is attached to the substrate at its perimeter. Within the cover are several parallel spaced apart ribs which project towards and press against the compliant member between the chips, and they form channels for a liquid coolant which carries heat away from the compliant member.

REFERENCES:
patent: 4138692 (1979-02-01), Meeker et al.
patent: 4381032 (1983-04-01), Cutchaw

Affiliated with

Also associated with

Rating

Liquid cooled multi-chip integrated circuit module incorporating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid cooled multi-chip integrated circuit module incorporating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid cooled multi-chip integrated circuit module incorporating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-86572