Liquid cooled metal thermal stack for high-power dies

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S080300, C165S185000, C257S719000, C361S705000, C361S708000, C361S710000, C361S715000, C361S719000

Reexamination Certificate

active

07023699

ABSTRACT:
The present invention provides a system for conducting heat away from an electrical component wherein the system has an elastically deformable member providing thermal communication with an electrical component. The system for conducting heat energy in an electronic assembly includes an electrical component, an elastically deformable member, and a housing. The elastically deformable member is placed in a compressed position between the electrical component and the housing such that the elastically deformable member is fixed into an assembled location. The elastically deformable member conducts heat energy away from the electrical component into the housing where it is dissipated into the environment. Since the compressed position fixes the location of the elastically deformable member, the system does not require a mechanical fastening to the electrical component thereby reducing thermo-mechanical fatigue. The elastically deformable member is made of a metal material allowing it to easily conduct the heat energy.

REFERENCES:
patent: 4233645 (1980-11-01), Balderes et al.
patent: 5459352 (1995-10-01), Layton et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 5812375 (1998-09-01), Casperson
patent: 6151215 (2000-11-01), Hoffman
patent: 6365964 (2002-04-01), Koors et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Liquid cooled metal thermal stack for high-power dies does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid cooled metal thermal stack for high-power dies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid cooled metal thermal stack for high-power dies will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3524611

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.