Liquid cooled integrated circuit assembly

Details Liquid cooled integrated circuit assembly Liquid cooled integrated circuit assembly

1989-10-24

1991-09-17

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 805, 357 82, H05K 720

Patent

active

050500368

ABSTRACT:
A liquid cooled integrated circuit assembly including a plurality of integrated circuit packages for housing and electrically interconnecting integrated circuits, a printed circuit board for mounting the integrated circuit packages, and flexing tubing for supplying coolant to the integrated circuit packages. Each integrated circuit package has a first cavity housing the semiconductor die and a second cavity for receiving the liquid coolant. The integrated circuit is mounted on a portion of the package which forms a wall separating the first and second cavities. Heat is transformed from the integrated circuit to the coolant by the wall separating the cavities. Thus, a minimum number of thermal interference are involved in transferring the heat generated by the integrated circuit and the thermal resistance of the heat transferring structure is approximately one-third of the thermal resistance of conventional packages.

REFERENCES:
patent: 3649738 (1972-03-01), Anderson et al.
patent: 4072188 (1978-02-01), Wilson
patent: 4644385 (1987-02-01), Nakanish
patent: 4652970 (1987-03-01), Watari
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4694378 (1987-09-01), Nakayama et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4781244 (1988-11-01), Kuramitsu
Fujitsu, Science Tech. Journal, 23, 4 pp. 243-254, 12/87, Yamamoto et al.

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