Liquid cooled high density packaging for high speed circuits

Details Liquid cooled high density packaging for high speed circuits Liquid cooled high density packaging for high speed circuits

1988-07-05

1989-07-11

Tolin, Gerald P.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 82, 361401, 16510426, 165907, H05K 720

Patent

active

048477311

ABSTRACT:
High power dissipating micro electronic circuit chips are cooled in a high ensity package by mounting individual chips on sintered stainless steel pads and surrounding the micro chips with a liquid fluoro-chemical to achieve cooling. The chips are directly bonded to the sintered stainless steel pads and are not packaged in chip carriers. The stainless steel pads provide a solid mounting for the chips to allow for wire bonding of the chips directly to the printed circuit board and electrical interconnections accommodate the differential coefficient of expansion between the chips and the housing. The stainless steel pads acts as wicks drawing the coolant fluid to the bottom side of the chips while the top side of the chips, also in direct contact with the coolant, enable the fluid to boil and remove heat during liquid to vapor transformation, thereby limiting the surface temperature of the chips to the boiling point of the coolant.

REFERENCES:
patent: 3739232 (1973-06-01), Grossman
patent: 3741292 (1973-06-01), Aakalu
patent: 3999105 (1976-12-01), Archey
patent: 4233645 (1980-11-01), Balderes
patent: 4245273 (1981-01-01), Feinberg
patent: 4366526 (1982-12-01), Lijoi
patent: 4381032 (1983-04-01), Cutchaw
patent: 4468717 (1984-08-01), Mathias
patent: 4561040 (1985-12-01), Eastman
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4744008 (1988-05-01), Black

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