Liquid cooled heat sink with cold plate retention mechanism

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S701000, C361S702000, C361S704000, C257S714000, C257S718000, C165S080400, C174S015100

Reexamination Certificate

active

07414844

ABSTRACT:
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

REFERENCES:
patent: 5966288 (1999-10-01), Batten et al.
patent: 6791838 (2004-09-01), Hung et al.

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