Liquid cooled heat sink with cold plate retention mechanism

Details Liquid cooled heat sink with cold plate retention mechanism Liquid cooled heat sink with cold plate retention mechanism

2006-12-12

2006-12-12

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S701000, C361S702000, C361S704000, C257S714000, C257S718000, C174S015100, C165S080400

Reexamination Certificate

active

07149087

ABSTRACT:
A system for cooling electronic components with a surface having one or more electronic components, including an integrated circuit, mounted thereon. A liquid cooled heat exchanger located in overlying contacting relation with the integrated circuit. A resilient cold plate coupled to the surface so as to be biased by a portion of the liquid cooled heat exchanger thereby providing a forced engagement between the liquid cooled heat exchanger, the integrated circuit, and the resilient cold plate.

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