Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-05-29
2007-05-29
Datskovskiy, Michael (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S700000, C361S695000, C257S714000, C165S121000
Reexamination Certificate
active
10900898
ABSTRACT:
A liquid-cooled heat sink assembly for cooling down an electronic component includes a main body (20) defining a central chamber (21) therein and having a number of fins (22) on an outside thereof, liquid coolant received in the central chamber, a first fan (40) received in the central chamber, and a second fan (60) positioned over the main body and engaged with the first fan. The heat sink assembly couples forced liquid cooling and forced airflow cooling, and need not extra pipes to form a circuit for the liquid coolant. Thus, not only the volume of the heat sink assembly is lessened, but also facilitates matching with electronic components.
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Gu Jian-Hua
He Li
Lee Tsung Lung
Liu Zhi-Gang
Wang Dong
Chung Wei Te
Datskovskiy Michael
Foxconn Technology Co., Ltd.
Fu Zhun Precision Ind. (Shenzhen) Co., Ltd.
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