Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-08-09
1999-09-28
Arroyo, Teresa M.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
361699, H01L 2334
Patent
active
059593512
ABSTRACT:
There is disclosed a liquid-cooled electronic device. Semiconductor devices are mounted on a substrate of a semiconductor module immersed in a cooling liquid. A wire-like member is provided in the vicinity of a cooling medium ejection port of each cooling medium supply member which cools a respective one of the semiconductor devices by a jet of the cooling liquid. With this arrangement, the flow of the cooling liquid downstream of the wire-like member is disturbed to promote the boiling over the entire surface of the semiconductor device, and when the semiconductor device is to be cooled, a transient temperature rise is reduced at the time of starting the energization of the semiconductor device, thereby stabilizing the temperature of the semiconductor device.
REFERENCES:
patent: 4783721 (1988-11-01), Yamamoto et al.
patent: 5023695 (1991-06-01), Omezawa et al.
patent: 5103374 (1992-04-01), Azar
patent: 5166863 (1992-11-01), Shmunis
patent: 5206791 (1993-04-01), Novotny
patent: 5270572 (1993-12-01), Nakajima et al.
IBM Technical Disclosure Bulletin, vol. 34, No. 3, Aug. 1991, pp. 300-301.
Ashiwake Noriyuki
Hatada Toshio
Idei Akio
Iino Toshiki
Kasai Kenichi
Arroyo Teresa M.
Hitachi , Ltd.
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