Liquid cooled diamond bearing heat sink

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S706000, C361S707000, C361S705000, C361S708000, C257S706000, C257S707000, C257S712000, C257S713000, C165S080300, C165S185000, C174S015100, C174S252000

Reexamination Certificate

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10832895

ABSTRACT:
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with the heat sink and its fins.

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