Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2007-05-08
2007-05-08
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S706000, C361S707000, C361S705000, C361S708000, C257S706000, C257S707000, C257S712000, C257S713000, C165S080300, C165S185000, C174S015100, C174S252000
Reexamination Certificate
active
10832895
ABSTRACT:
A liquid cooled heat sink for cooling integrated and power modules. The heat sink is formed of a Diamond, Silicon Carbide composite and is provided with heat transfer facilitating fins and an enclosure for routing the cooling liquid into heat transfer contact with the heat sink and its fins.
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Lawler John
Moghaddam Saeed
Ohadi Michael
Chervinsky Boris
Pape Zachary
Rosenberg , Klein & Lee
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