Liquid cooled cooling device

Details Liquid cooled cooling device Liquid cooled cooling device

1993-01-04

1996-09-17

Ford, John K.

Heat exchange

Structural installation

165 804, 165 96, 165101, 165169, F25D 3100, F25D 102, F28D 700, F28D 710

Patent

active

055559280

DESCRIPTION:

BRIEF SUMMARY
BACKGROUND OF THE INVENTION



FIELD OF THE INVENTION

The present invention relates to a liquid cooled cooling device which is attached to the heat generating section, for example, of a semiconductor device fabrication apparatus, and which is used for the cooling of the heat generating section using a cooling liquid such as cold water.
In, for example, a fabrication apparatus for semiconductor devices, countermeasures to the vibration and temperature accompanying an increase in the degree of integration of semiconductor integrated circuits, and furthermore, to the operating costs thereof, present difficult problems. For example, in processes for the formation of an integrated circuit with a superfine pattern on a wafer, even slight vibrations, which do not normally present a problem, can have a large adverse effect. In particular, superprecision apparatuses such as EB exposure apparatuses, which are necessary steps in the fabrication of superfine semiconductor devices, have an extremely large number of sources which generate vibration. There are various ways by which these vibrations may be propagated. In addition, the superprecision apparatus includes heat generating sections which generate a large amount of heat. A slight vibration caused by the sources that generate vibration and a change in temperature caused by the heat generating sections cause a slight variation, thermal expansion in an alignment stage, variation in the index of refraction of the optical path, etc. This can have extremely large effects on the accuracy of alignment. In addition, it is necessary to provide for heat dissipation with respect to heat generating sections, so that a cooling device is necessary.
Among such cooling devices, a device such as that shown in FIG. 7 is commonly known. In accordance with such a device, a cooling pipe RK comprising a thin metal tube which is in contact with the outer peripheral portion of the heat generating section HB, is wrapped therearound; cold water, which is used as a cooling liquid, flows into a flow-in portion LN at one end of this cooling pipe RK, and, after cooling, this cold water flows out from a flow-out portion LO at the other end of the cooling pipe RK. Here, the heat generating section HB exhibits a cylindrical form with a diameter of 300 mm and a length of 300 mm, and the cooling pipe RK is wound 15 times therearound. Accordingly, the water flow resistance of this cooling apparatus is 800 mmAq/m.times.14.1 m=11280 mmAq.congruent.1.1 kg/cm.sup.2.
In this case, if the temperature of the cooling liquid at the flow-in portion is represented by T.sub.1, and the temperature at the flow-out portion is represented by T.sub.2, it is common to set the temperatures T.sub.1 and T.sub.2 so that the arithmetic mean thereof is equal to the atmospheric temperature T.sub.0 of the space in which the cooling device is disposed. In conventional cooling water supply systems, no attempts were made to conduct accurate control of the temperature of the cooling water, and the amount of cooling water supplied was fixed in accordance with the maximum load period.
However, in such structures in accordance with this technological background, the water flow resistance of the entire cooling water supply system exceeds, for example, 4 kg/cm.sup.2, and in particular, the cooling pipe RK comprising the central part of the cooling structure comprises a continuous thin metal pipe, so that the water flow resistance within the cooling pipe RK exceeds 1 kg/cm.sup.2, so that problems occur, such as difficulties in suppressing the generation of slight vibration, increases in operating costs of devices including cooling devices accompanying an increase in water flow resistance, and in water supply force, and the fact that a temperature gradient develops over the large range between the flow-in portion LN and the flow-out portion LO of the cooling pipe RK; that is to say, a thermal load distribution is produced in the portion to be cooled, and this causes temperature fluctuations toward the periphery thereof.
For example,

REFERENCES:
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patent: 3024606 (1962-03-01), Adams et al.
patent: 3167812 (1965-02-01), Von Bennigsen
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patent: 4628991 (1986-12-01), Hsiao et al.
patent: 4763722 (1988-08-01), Piazzola
patent: 5005640 (1991-04-01), Lapinski et al.
Melz, et al. "Precise Temperature Control with a Secondary Circuit Layout" 279 Kunstsoffberator 33 (1988) May No. 5 p. 42.

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