Liquid-cooled circuit package with micro-bellows for controlling

Details Liquid-cooled circuit package with micro-bellows for controlling Liquid-cooled circuit package with micro-bellows for controlling

1994-02-28

1994-12-13

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 257714, H05K 720

Patent

active

053734173

ABSTRACT:
The heat dissipation and mechanical stability of an electronic circuit module package (10) is enhanced by filling the module cavity (20) with a perflourinated hydrocarbon cooling liquid, and by placing a micro-bellows (24, 28) within the module cavity. The temperature compression and expansion characteristics of the perflourinated hydrocarbon liquid are compensated by the action of the micro-bellows. The module package contains semiconductor die (16, 18) that require cooling during operation. The perflourinated hydrocarbon liquid provides the necessary heat transfer to the module package.

REFERENCES:
patent: 3091722 (1963-05-01), Borowiec et al.
patent: 3986080 (1976-10-01), Sato
patent: 5305184 (1994-04-01), Andresen et al.

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