Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1995-03-22
1996-07-23
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
165 804, 257714, H05H 720
Patent
active
055396178
DESCRIPTION:
BRIEF SUMMARY
BACKGROUND OF THE INVENTION
The present invention relates to a liquid-coolant cooling element for cooling heat-generating disk-shaped components.
Liquid-coolant cooling elements are known for cooling power semiconductor components. The increase in the switching power of semiconductor components is coupled with the generation of a higher heat loss. In general, liquid-coolant cooling elements have a larger cooling power and more easily resist the shock and transition conditions, since their thermal inertia enables short thermal pulses to be equalized with only a slight increase in temperature. The cooling elements are constructed in many cases as cylindrical or cuboid elements with supply and discharge connecting pieces. In the interior of the cooling element a system of channels is constructed which are either parallel or otherwise connected to each other. In some cases, the distribution of the cooling liquid is carried out using constructed partitions. Alternatively, various erections of pins are placed in the path of the liquid flow. All these arrangements are used for increasing the contact surface which transmits the heat to the cooling liquid.
German Patent Document No. DE-A-16 39 047 discloses a cooling element arrangement for semiconductor components which comprises a cooling element, a reversing piece and an end piece. The cooling element and the reversing piece are provided with channels. These cooling and reversing channels preferably have the same shape and dimensions and are offset with respect to each other in such a way that at least two adjacently located cooling channels are connected to each other by a reversing channel. This reversing piece can comprise metal or plastic. Apart from the reversing channels, it contains outflow channels located on the periphery and a centrally located inflow channel. This reversing piece is included in the end piece and is fastened with the latter to the surface of the cooling element facing away from the semiconductor body. The end piece contains a circular ring-shaped collecting channel which is arranged such that all the outflow channels of the reversing piece open into it. Furthermore, this collecting channel is connected to an outlet. An inlet in the end piece is located opposite the opening of the inflow channel of the reversing piece. Because of this configuration of the cooling element arrangement, the coolant runs between the inlet and outlet underneath the surface to be cooled of the semiconductor body, in serpentine fashion. The reversing piece and the end piece can also form one constructional unit.
If the cooling element arrangement comprises a plurality of parts, the contact surfaces between the latter parts must be machined such that a tight seal results, or corresponding seals must be laid between them. Furthermore, the expenditure for producing this cooling element arrangement is very large, since the cooling channels in the cooling element and the reversing channels in the reversing piece must be constructed very accurately in order that the opening of each reversing channel is located directly opposite parts of the opening of at least two cooling channels in the assembled condition.
A cooling can is disclosed in German Patent Document No. DE-A-19 14 790 which is composed of an essentially rectangular connection plate and two cooling pots arranged around the connection plate. The cooling pots have relatively wide and thick collars at the periphery, which are used for the screw connection to the connection plate. That part of the connection plate projecting beyond the cooling pots is simultaneously used as a current connection. The cooling pots contain on the inside a liquid distributor in the form of a plurality of webs which are connected to a central passage and an eccentric passage, with the result that an asymmetrical liquid flow with a relatively large pressure drop prevails in the interior of the cooling pots. A relatively large thermal resistance is produced by this reduction of the pressure drop. The thermal resistance states how mu
REFERENCES:
patent: 3361195 (1968-01-01), Meyerhoff et al.
patent: 4183042 (1980-01-01), Novak et al.
patent: 5088006 (1992-02-01), del Puerto et al.
Siemens Aktiengesellschaft
Thompson Gregory D.
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