Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-02-08
2005-02-08
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S002000, C134S034000
Reexamination Certificate
active
06852173
ABSTRACT:
The present invention is directed to the use of a high vapor pressure liquid prior to or simultaneous with cryogenic cleaning to remove contaminants from the surface of substrates requiring precision cleaning such as semiconductors, metal films, or dielectric films. A liquid suitable for use in the present invention preferably has a vapor pressure above 5 kPa and a freezing point below −50° C.
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Jointly written by: European Elect. Component Manufactures Assc., Japan Elect. & Information Tech. Industries Assc., Korea Semiconductor Industry Assc., Taiwan Semiconductor Industry Assc., Semiconductor Industry Assc, International Technology Roadmap for Semiconductors 2001 EditionExecutive Summary—pp. 12-16.
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Banerjee Souvik
Chung Harlan Forrest
Barr Michael
BOC, Inc.
Chaudhry Saeed T
Cohen Joshua L.
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