Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1993-03-08
1994-10-25
Ball, Michael W.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
114222, 156 71, 428907, B29C 6336
Patent
active
053585895
ABSTRACT:
The invention provides a method for the lining of an organism deposit-inhibition structure, which enables that structure to be easily lined to an application surface, has superior characteristics to inhibit deposition of organisms and durability, dispenses with maintenance work, and offers no toxicity problems. A resin layer made up of an electrical insulating material is bonded to the inner wall periphery of a cylindrical pipe member. A metal gauze of a copper alloy is applied onto the surface of the resin layer. The metal gauze is either unfolded and drawn out or rolled over with the inner side turned outwards for its application to the surface of the resin layer. The copper alloy has a Be content of 0.2 to 2.8% by weight, and is selected from, e.g., Be--Cu, Be--Co--Cu, Be--Co--Si--Cu and Be--Ni--Cu alloys.
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Ball Michael W.
Maki Steven D.
NGK Insulators Ltd.
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