Linear type deposition source

Details Linear type deposition source Linear type deposition source

2011-03-15

2011-03-15

Chen, Keath T (Department: 1712)

Coating apparatus

Gas or vapor deposition

Crucible or evaporator structure

Reexamination Certificate

active

07905961

ABSTRACT:
A linear type deposition source capable of improving a heating efficiency and reducing a heating temperature by using a plate-type heating source and/or improving a cooling efficiency by including a cooling jacket having a cooling water line in a housing. The linear type deposition source includes: a crucible arranged in a deposition chamber, the crucible being for evaporating materials included in the crucible; a heating source for applying heat to the crucible; a housing for isolating the heat emitted from the heating source; an outer wall for anchoring the crucible; and a nozzle unit for spraying the materials evaporated from the crucible. In this deposition source, the heating source is a plate-type heating source, and the housing has a cooling water line so cooling water can flow through the cooling water line.

REFERENCES:
patent: 2440135 (1948-04-01), Alexander
patent: 4543467 (1985-09-01), Eisele et al.
patent: 4550411 (1985-10-01), Stonestreet et al.
patent: 4845956 (1989-07-01), Berntsen et al.
patent: 5803976 (1998-09-01), Baxter et al.
patent: 5827371 (1998-10-01), Colombo et al.
patent: 5902634 (1999-05-01), Maschwitz et al.
patent: 6101316 (2000-08-01), Nagashima et al.
patent: 6296956 (2001-10-01), Hunter
patent: 6562140 (2003-05-01), Bondestam et al.
patent: 2002/0148402 (2002-10-01), Kou et al.
patent: 2003/0015140 (2003-01-01), Van Slyke et al.
patent: 2004/0163600 (2004-08-01), Hoffmann et al.
patent: 2005/0011448 (2005-01-01), Iwata
patent: 2005/0051096 (2005-03-01), Horsky et al.
patent: 1320172 (2001-10-01), None
patent: 1550569 (2004-12-01), None
patent: 1555089 (2004-12-01), None
patent: 1626698 (2005-06-01), None
patent: 44 39 519 (1996-04-01), None
patent: 61-009574 (1986-01-01), None
patent: 61-220414 (1986-09-01), None
patent: 01-159369 (1989-06-01), None
patent: 03-007883 (1991-01-01), None
patent: 5-78826 (1993-03-01), None
patent: 6-299336 (1994-10-01), None
patent: 07-300666 (1995-11-01), None
patent: 08-092733 (1996-04-01), None
patent: 09-111441 (1997-04-01), None
patent: 11-323552 (1999-11-01), None
patent: 2000-012218 (2000-01-01), None
patent: 2000 504645 (2000-04-01), None
patent: 2000-160328 (2000-06-01), None
patent: 3608415 (2004-10-01), None
patent: 2005-015869 (2005-01-01), None
patent: 2002-0000356 (2002-01-01), None
patent: 2002-0086761 (2002-11-01), None
patent: 2003-0038268 (2003-05-01), None
patent: 10-2004-0081264 (2004-09-01), None
patent: 200710241 (2007-03-01), None
patent: 200714725 (2007-04-01), None
Patent Abstracts of Japan for Publication No. 11-323552; Date of Publication of Application Nov. 26, 1999 in the name of Azuma et al.
Patent Abstracts of Japan for Application No. 11-016546; Filed Jan. 26, 1999 in the name of Oshima et al.
Korean Patent Abstract for Publication No. 10-2003-0038268; Date of Publication of Application May 16, 2003 in the name of Baek et al.
TIPO Examination Report dated Dec. 18, 2008 for corresponding Taiwan application 095131093 with English translation, indicating relevance of references listed in this IDS.
Japanese Office action dated May 19, 2009, for Japanese application 2006-113737, noting listed references in this IDS.
Japanese Office action dated Jul. 28, 2009, for Japanese application 2006-191897, noting listed references in this IDS.
Patent Abstracts of Japan, Publication No. 2005-015869, dated Jan. 20, 2005, in the name of Junichiro Sakata.
Japanese Office action dated Jul. 21, 2009, for corresponding Japanese application 2006-198618, noting listed reference in this IDS, as well as JP 61-220414, previously filed in an IDS dated Dec. 12, 2006, and JP 2000-160328 and JP 2000-012218 previously filed in an IDS dated Aug. 17, 2009.
SIPO Office action dated Oct. 24, 2008 for Chinese Application 200610112373.3 with English translation, noting listed U.S. reference in this IDS, namely, U.S. Publication 2003/0015140.
TIPO Examination Report dated Jan. 22, 2009 for Taiwanese Application 095131101, noting listed U.S. reference in this IDS, namely, U.S. Patent 4,845,956 and JP 61-220414.
TIPO Examination Report dated Dec. 17, 2008 for Taiwanese Application 095131097, noting listed reference in this IDS, namely, TW 200714725.
English translation of German application DE 44 39 519 listed above.
U.S. Office action dated May 27, 2009, for related U.S. Appl. No. 11/515,364, noting listed German reference and U.S. references in this IDS, namely, U.S. Publication 2003/0015140, and U.S. Patents 5,827,371 and 6,101,316.
Patent Abstracts of Japan, Publication No. 61-220414, dated Sep. 30, 1986, in the name of Toshio Fujii et al.
Patent Abstracts of Japan, Publication No. 05-078826, dated Mar. 30, 1993, in the name of Muneyuki Imafuku et al.
Patent Abstracts of Japan, Publication No. 06-299336, dated Oct. 25, 1994, in the name of Yukio Kikuchi et al.
Korean Patent Abstracts, Publication No. 10200200000356 dated Jan. 5, 2002, in the name of Geon Hui Kim et al.
Korean Patent Abstracts, Publication No. 1020040081264, dated Sep. 21, 2004, in the name of Hun Kim et al.
SIPO Office action dated Oct. 24, 2008 for corresponding China application 2006101277093, with English translation indicating relevance of listed references in the IDS.
U.S. Office action dated Jun. 12, 2009, for related U.S. Appl. No. 11/514,318, noting listed U.S. reference in this IDS.
Chinese Office action dated Apr. 17, 2009, for corresponding Chinese application 200610112370.X, with English translation noting listed references in this IDS, as well as U.S. Publication 2003/0015140 filed in an IDS dated Jun. 4, 2009.
U.S. Office action dated Nov. 27, 2009, for related U.S. Appl. No. 11/515,364, noting reference listed in this IDS.
Japanese Office action dated Mar. 16, 2010, for corresponding Japanese Patent application 2006-191897, noting listed references in this IDS.
Patent Abstracts of Japan, Publication No. JP 01-159369, dated Jun. 22, 1989, in the name of Tada Isao.
Japanese Office action dated Apr. 20, 2010, for corresponding Korean Application No. 10-2005-0080996.
U.S. Office Action dated Jun. 15, 2010, for related U.S. Appl. No. 11/514,318.

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