Linear substrate transport apparatus

Details Linear substrate transport apparatus Linear substrate transport apparatus

2011-08-02

2011-08-02

Adams, Gregory W (Department: 3652)

Material or article handling

Apparatus for moving material between zones having different...

C414S939000, C414S584000, C414S222120, C156S345310, C204S298250, C198S619000

Reexamination Certificate

active

07988398

ABSTRACT:
Substrate processing apparatus having a chamber, a generally linear array of process modules, a substrate transport, and a drive system. The chamber is capable of being isolated from the outside atmosphere. Each process module of the array is communicably connected to the chamber to allow a substrate to be transferred between the chamber and process module. The substrate transport is located in and is movably supported from the chamber. The transport is capable of moving along a linear path defined by the chamber for transporting the substrate between process modules. The drive system is connected to the chamber for driving and moving the transport along the linear path. The chamber comprises a selectable number of chamber modules serially abutted to defined the chamber. Each module has an integral portion of the drive system.

REFERENCES:
patent: 3845720 (1974-11-01), Bohn et al.
patent: 4624617 (1986-11-01), Belna
patent: 4664578 (1987-05-01), Kakehi
patent: 4717461 (1988-01-01), Strahl et al.
patent: 4766993 (1988-08-01), Kita et al.
patent: 4805761 (1989-02-01), Totsch
patent: 4825808 (1989-05-01), Takahashi et al.
patent: 4886592 (1989-12-01), Anderle et al.
patent: 4917446 (1990-04-01), Mariani
patent: 5086729 (1992-02-01), Katagiri
patent: 5154730 (1992-10-01), Hodos et al.
patent: 5259881 (1993-11-01), Edwards et al.
patent: 5275709 (1994-01-01), Anderle et al.
patent: 5309049 (1994-05-01), Kawada et al.
patent: 5380682 (1995-01-01), Edwards et al.
patent: 5417537 (1995-05-01), Miller
patent: 5571325 (1996-11-01), Ueyama et al.
patent: 5641054 (1997-06-01), Mori et al.
patent: 5651868 (1997-07-01), Canady et al.
patent: 5655277 (1997-08-01), Galdos et al.
patent: 5695564 (1997-12-01), Imahashi
patent: 5700127 (1997-12-01), Harada et al.
patent: 5788447 (1998-08-01), Yonemitsu et al.
patent: 5846328 (1998-12-01), Aruga et al.
patent: 5882165 (1999-03-01), Maydan et al.
patent: 5894760 (1999-04-01), Caveney
patent: 5994798 (1999-11-01), Chitayat
patent: 5998889 (1999-12-01), Novak
patent: 6206176 (2001-03-01), Blonigan et al.
patent: 6235634 (2001-05-01), White et al.
patent: 6238161 (2001-05-01), Kirkpatrick et al.
patent: 6271606 (2001-08-01), Hazelton
patent: 6288366 (2001-09-01), Dings
patent: 6318951 (2001-11-01), Schmidt et al.
patent: 6361268 (2002-03-01), Pelrine et al.
patent: 6468021 (2002-10-01), Bonora et al.
patent: 6471459 (2002-10-01), Blonigan et al.
patent: 6483222 (2002-11-01), Pelrine et al.
patent: 6503365 (2003-01-01), Kim et al.
patent: 6517303 (2003-02-01), White et al.
patent: 6540869 (2003-04-01), Saeki et al.
patent: 6634845 (2003-10-01), Komino
patent: 6641350 (2003-11-01), Nakashima et al.
patent: 6776880 (2004-08-01), Yamazaki
patent: 6852194 (2005-02-01), Matsushita et al.
patent: 6962471 (2005-11-01), Birkner et al.
patent: 7090741 (2006-08-01), Narushima et al.
patent: 2001/0026748 (2001-10-01), Blonigan et al.
patent: 2002/0021050 (2002-02-01), Fujisawa et al.
patent: 2002/0089237 (2002-07-01), Hazelton
patent: 2002/0150448 (2002-10-01), Mizokawa et al.
patent: 2002/0192056 (2002-12-01), Reimer et al.
patent: 2003/0129045 (2003-07-01), Bonora et al.
patent: 2003/0217668 (2003-11-01), Fiske et al.
patent: 1 365 040 (2003-11-01), None
patent: 2001195130 (2001-07-01), None
patent: WO99/23504 (1999-05-01), None
patent: WO99/33691 (1999-07-01), None
patent: WO99/59190 (1999-11-01), None
patent: WO99/59928 (1999-11-01), None
patent: WO/99/60611 (1999-11-01), None
patent: WO/99/61350 (1999-12-01), None
patent: WO00/68974 (2000-11-01), None
patent: WO01/02211 (2001-01-01), None
patent: WO01/22477 (2001-03-01), None
patent: WO01/38124 (2001-05-01), None
patent: WO01/71684 (2001-09-01), None
patent: WO02/051728 (2002-07-01), None
patent: WO02/099854 (2002-12-01), None
patent: WO03/038869 (2003-05-01), None
Patent Abstracts of Japan, No. 2004040089, filed May 21, 2003, Evers et al.
Distributed Servo Products, Agile Systems, Inc. 3 pages.
“A Low Cost USB-CAN Distributed Motion Control System”, Circuit Cellular Website, 8 pages.
“Distributed Motion Control . . . ”, Chris Rand, Engineeringtalk Website, 2 pages.
“Rorze Products Overview”, RR-713 Robot, Rorze Automation Products Website, 2 pages.
“Semiconductor Equipment Design for Short Cycle Time Manufacturing”, Future Fab International Website , Yoshinobu Hayashi et al., 9 pages.
International SEMA Tech 13001 Factory Guidelines: Version 5.0, 139 pages.
“Fundamentals of Modern Manufacturing”, Materials, Processes, and Systems, Second Edition, Mikell P. Groover, 14 pages.
“The Automated Semiconductor Fabricator, Circa 2020”, Mitchell Weiss, 2 pages.
ITRS 2001 Factory Integration Chapter, “Material Handling Backup System”, 2005, ITRS Factory Integration TWG, 46 pages.
Daifunku America Corporation, “Cleanway 700 CLW-700”, 1 page.
Daifunku America Corporation, Cleanway 600 CLW-600, 1 page.
“Semiconductor Equipment for Short Cycle Time Manufacturing”, Yoshinobu Hayashi, Tokyo Electron Ltd. 5 Pages.
“Silicon Wafer Transport in a High Vacuum, Microgravity Environment”, from Professor Glenn Chapman's Home Page, 24 Pages.
Product Description of “Ferrofluidic Sealing Sub-Assemblies”, Ferrotec USA, 3 pages.
“Linear Motor Robots Finding Varied Applications . . . 3 pages”.
“Industrial Robotics; Technology Programming and Applications”, Mikel Groover et al., 16 pages.
“Flexible Material Handling Automation in Wafer Fabrication”, James P. Harper et al., Veeco Integrated Automation, Inc. 6 pages.
Excerpted Pages From Manufacturing Engineering and Technology, Third Edition, 4 pages.
ULVAC Product Description of In-Line Sputter Systems New SDP-s Series, 1 page.

Affiliated with

Also associated with

Rating

Linear substrate transport apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Linear substrate transport apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Linear substrate transport apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2775295