Linear split axis wire bonder

Details Linear split axis wire bonder Linear split axis wire bonder

2008-01-22

2008-01-22

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

C228S180500

Reexamination Certificate

active

07320424

ABSTRACT:
A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.

REFERENCES:
patent: 4266710 (1981-05-01), Bilane et al.
patent: 4361261 (1982-11-01), Elles et al.
patent: 4422568 (1983-12-01), Elles et al.
patent: 4550871 (1985-11-01), Chan et al.
patent: 4792079 (1988-12-01), Bansemir
patent: 5156318 (1992-10-01), Suzuki et al.
patent: 5699951 (1997-12-01), Miyoshi
patent: 5735449 (1998-04-01), Magni
patent: 5839640 (1998-11-01), Kinnaird
patent: 5897048 (1999-04-01), Cheng
patent: 5901896 (1999-05-01), Gal
patent: 5909837 (1999-06-01), Safabakhsh et al.
patent: 5931372 (1999-08-01), Miller
patent: 5979739 (1999-11-01), Jin et al.
patent: 6109501 (2000-08-01), Cheng et al.
patent: 6122307 (2000-09-01), Koseki
patent: 6126432 (2000-10-01), Okada et al.
patent: 6434726 (2002-08-01), Goossen
patent: 6460751 (2002-10-01), Thürlemann
patent: 6616030 (2003-09-01), Miller
patent: 6640423 (2003-11-01), Johnson et al.
patent: 6774651 (2004-08-01), Hembree
patent: 6913838 (2005-07-01), McCullough et al.
patent: 2002/0162875 (2002-11-01), Miller
patent: 2003/0084563 (2003-05-01), Ohkubo et al.
patent: 2004/0129754 (2004-07-01), Suresh et al.
patent: 2005/0247758 (2005-11-01), Beatson et al.

Affiliated with

Also associated with

Rating

Linear split axis wire bonder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Linear split axis wire bonder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Linear split axis wire bonder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2766003