Linear polisher and method for semiconductor wafer planarization

Details Linear polisher and method for semiconductor wafer planarization Linear polisher and method for semiconductor wafer planarization

1996-12-03

1997-12-02

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451307, 451443, 451 60, 451173, 125 21, B24B 100

Patent

active

056929471

ABSTRACT:
A wafer polisher and method for the chemical mechanical planarization of semiconductor wafers. The polisher includes a wafer holder for supporting the semiconductor wafer and a linear polishing assembly having a polishing member positioned to engage the surface of the wafer. The polishing member is movable in a linear direction relative to the wafer surface to uniformly polish the surface of the wafer. A pivotal alignment device may be used to pivotally support one of the wafer holder and the polishing member relative to the other of the wafer holder and the polishing member with the surface of the wafer and the polishing member retained in parallel alignment during operation of the polisher. The polisher optionally includes a conditioning station for conditioning the polishing member.

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