Linear planar-magnetron sputtering apparatus with reciprocating

Details Linear planar-magnetron sputtering apparatus with reciprocating Linear planar-magnetron sputtering apparatus with reciprocating

1992-12-11

1994-07-12

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20419212, 20429809, 20429819, C23C 1434

Patent

active

053285859

ABSTRACT:
A linear planar-magnetron sputtering cathode comprises a cathode body (22) including two side-walls (104) two end-walls (106) and a target-supporting member (102) attached to the walls. The cathode body encloses a magnet array (40) which may be moved reciprocally in at least one direction relative to the cathode body. A cooling fluid may be flowed through the target supporting member for cooling the target. A cooling fluid may also be flowed through the side-walls and the end-walls for cooling the end walls. A cooled enclosure is thus be provided for the magnet-array.

REFERENCES:
patent: 4204942 (1980-05-01), Chahroudi
patent: 4422916 (1983-12-01), McKelvey
patent: 4849087 (1989-07-01), Meyer
patent: 4855033 (1989-08-01), Hurwitt
patent: 5171415 (1992-12-01), Miller et al.
patent: 5188717 (1993-02-01), Broadbent et al.

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