Linear pad conditioning apparatus

Abrading – Accessory – Dressing

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

451320, 451324, 451444, 451164, B24B 5300

Patent

active

061495123

ABSTRACT:
A linear pad conditioning mechanism provides a linear in situ or ex situ conditioning for a polishing pad mounted on a polishing belt of a CMP apparatus. The linear pad conditioning mechanism includes a linear oscillation mechanism for driving a conditioning pad in a direction orthogonal to the polishing belt's direction of travel. In one example, multiple conditioning assemblies are provided to each provide a trapezoidal conditioning pad, and the conditioning assemblies are positioned such that a constant-width area in the polishing belt's direction of travel is provided. In that example, a rotational mechanism is provided to position the conditioning pad between a conditioning position against the polishing pad, and a cleaning position in a bath of cleaning fluid. Further, each conditioning assembly is provided a fluid delivery system to a conditioner block, so that a conditioner fluid can be delivered at the point of use.

REFERENCES:
patent: 3571979 (1971-03-01), Manchester
patent: 3753269 (1973-08-01), Budman
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5484323 (1996-01-01), Smith
patent: 5611943 (1997-03-01), Cadien et al.
patent: 5692947 (1997-12-01), Talieh et al.
patent: 5779526 (1998-07-01), Gill
patent: 5885147 (1999-03-01), Kreager et al.
patent: 5916010 (1999-06-01), Varian

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Linear pad conditioning apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Linear pad conditioning apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Linear pad conditioning apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1252312

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.