Linear motor pump for wave soldering systems

Details Linear motor pump for wave soldering systems Linear motor pump for wave soldering systems

1996-10-29

1998-10-06

Heinrich, Samuel M.

Metal fusion bonding

Including means to apply flux or filler to work or applicator

By partial or total immersion of work or applicator into liquid

228260, 118429, 219214, 219628, 219634, 219672, 392465, 392466, 392471, 310 11, B23K 306

Patent

active

058164740

ABSTRACT:
The linear motor pump for a wave soldering apparatus comprises in accordance with the invention several pumping channels arranged substantially parallel to each other and separate from each other. It includes preferably a multiply segmented stator. Each stator segment has one pumping channel allocated to same. By means of this a homogeneous pumping performance i.e. homogeneous pumping pressure distribution over a practically arbitrary width is achieved, which leads to a homogeneous solder wave. By the arrangement of the pumping channels and the design of the stator in accordance with the invention a turbulent whirling of the solder is made practically impossible.

REFERENCES:
patent: 3685715 (1972-08-01), Perrin
patent: 3797724 (1974-03-01), Flury et al.
patent: 3941088 (1976-03-01), Ronafoldi et al.
patent: 4375270 (1983-03-01), Minchev et al.
patent: 4568012 (1986-02-01), Kakuhata et al.

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