Limiting tin sludge formation in tin or tin-lead electroplating

Details Limiting tin sludge formation in tin or tin-lead electroplating Limiting tin sludge formation in tin or tin-lead electroplating

1990-09-20

1992-03-10

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

205303, C25D 358

Patent

active

050947265

ABSTRACT:
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

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