Chemistry: electrical and wave energy – Processes and products
Patent
1990-09-20
1991-11-19
Niebling, John
Chemistry: electrical and wave energy
Processes and products
204 541, C25C 332, C25D 360
Patent
active
050663674
ABSTRACT:
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.
REFERENCES:
patent: 905837 (1908-12-01), Broadwell
patent: 1947652 (1934-02-01), Langedijk
patent: 2147415 (1939-02-01), Tucker
patent: 2174507 (1939-09-01), Tinker et al.
patent: 2187338 (1940-01-01), Werntz
patent: 2195409 (1940-04-01), Flett
patent: 2398426 (1946-04-01), Hanford
patent: 2401428 (1946-06-01), Kosmin
patent: 2460252 (1949-01-01), DuRose et al.
patent: 2525942 (1950-10-01), Proell
patent: 3082157 (1963-03-01), Francisco et al.
patent: 3429790 (1969-02-01), Schott et al.
patent: 3661730 (1972-05-01), Nishihura
patent: 3663384 (1972-05-01), Lescure
patent: 3694329 (1972-09-01), Kampe
patent: 3730853 (1973-05-01), Sedlacek et al.
patent: 3749649 (1973-07-01), Valazil
patent: 3769182 (1973-10-01), Beckwith et al.
patent: 3785939 (1974-01-01), Hsu
patent: 3860502 (1975-01-01), Johnson
patent: 3875029 (1975-04-01), Rosenberg et al.
patent: 3905878 (1975-09-01), Dohi et al.
patent: 3926749 (1975-12-01), Passal
patent: 3956126 (1976-05-01), Rosenberg et al.
patent: 3977949 (1976-08-01), Rosenberg et al.
patent: 4000047 (1976-12-01), Ostrow et al.
patent: 4053372 (1977-10-01), Davis
patent: 4061547 (1977-12-01), Rosenberg
patent: 4072582 (1978-02-01), Rosenberg
patent: 4118289 (1978-10-01), Hsu
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4135991 (1979-01-01), Canaris et al.
patent: 4139425 (1979-02-01), Eckles et al.
patent: 4242182 (1980-12-01), Popescu
patent: 4270990 (1981-06-01), Fong
patent: 4384930 (1983-05-01), Eckles
patent: 4388158 (1983-06-01), Inui et al.
patent: 4459185 (1984-07-01), Obata et al.
patent: 4565609 (1986-01-01), Nobel et al.
patent: 4565610 (1986-01-01), Nobel et al.
patent: 4582576 (1986-04-01), Opaskar et al.
patent: 4599149 (1986-07-01), Nobel et al.
patent: 4617097 (1986-10-01), Nobel et al.
patent: 4662999 (1987-05-01), Opaskar et al.
patent: 4673470 (1987-06-01), Obata et al.
patent: 4701244 (1987-10-01), Nobel et al.
patent: 4717460 (1988-01-01), Nobel et al.
patent: 4871429 (1989-10-01), Nobel et al.
patent: 4880507 (1989-11-01), Toben et al.
Dohi, Bright Solder Plate, Metal Finishing, Oct. 1966, pp. 62-63.
Dohi et al., "Bright Solder and Indium Plating from Methane Sulfonic Acid", Proceeding of Electroplating Seminar, 7/78.
Dohi et al., "Electrodeposition of Bright Tin-Lead Alloys from Alkanolsufonate Baths", proceedings of Interfinish 80.
Nobel Fred I.
Ostrow Barnet D.
Lea-Ronal, Inc.
Marquis Steven P.
Niebling John
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