Limiting tin sludge formation in tin or tin/lead electroplating

Details Limiting tin sludge formation in tin or tin/lead electroplating Limiting tin sludge formation in tin or tin/lead electroplating

1988-04-29

1989-10-03

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 541, C25D 332, C25D 360

Patent

active

048714291

ABSTRACT:
Baths and methods for electroplating tin or tin-lead alloys wherein the formation of tetravalent tin and stannic oxide sludge is reduced or prevented. These baths contain a soluble divalent tin compound, a soluble alkyl or alkylol sulfonic acid at least one wetting agent, and a hydroxyl phenyl compound reducing agent. Other compounds may be added to the bath for improving its performance during electroplating.

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