Limiting heat flow in planar, high-density power resistors

Details Limiting heat flow in planar, high-density power resistors Limiting heat flow in planar, high-density power resistors

1992-09-28

1994-03-01

Lateef, Marvin M.

Electrical resistors

With heat-storing

338 7, 338 53, 338220, H01C 108

Patent

active

052911756

ABSTRACT:
A chip resistor whose resistive element provides a power density of at least 20 watts per square inch is provided with an air gap between the resistance element and the electrical contact junctions of the conductive strips electrically connected to the resistance element and terminals attached to the chip resistor. The air gap has a length approximately 70% of the distance between opposing edges of the planar body forming the chip to so restrict heat flow as to prevent the electrical contact junctions from exceeding a temperature of about 175.degree. C. when the resistive element is at a temperature of 350.degree. C. or more.

REFERENCES:
patent: 3497859 (1970-02-01), Bang
patent: 4256796 (1981-03-01), Hang et al.
patent: 4333069 (1982-06-01), Worth et al.
patent: 4658234 (1987-04-01), Takayanagi
patent: 4939498 (1990-07-01), Yamada et al.

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