Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1996-02-12
1999-06-29
Stemmer, Daniel
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156285, 181199, 264258, A47B 8106, B32B 3104
Patent
active
059164050
ABSTRACT:
A speaker enclosure having a substantially seamless rigid outer skin, a middle sound absorbing layer, and a substantially seamless flexible inner skin. The speaker enclosure is comprised of two basic parts, a box section and a baffle section where each of these sections include the rigid outer skin, the middle sound absorbing layer and the seamless flexible inner skin and are made according to the same method. The outer skin is formed from multiple layers of resin impregnated carbon fiber, the middle sound absorbing layer includes pieces of honeycomb material and the inner layer is formed from multiple layers of resin impregnated fiberglass. The layers of material are arranged in a substantially seamless manner into a mold and then cured by vacuum bagging and heating thereby producing a strong, lightweight speaker enclosure made of materials which dampen the transmission of errant sound waves in the enclosure and thereby minimize distortion of the sound signal produced by the speaker.
REFERENCES:
patent: 1965830 (1934-07-01), Hammer
patent: 2670053 (1954-02-01), Doms
patent: 3804195 (1974-04-01), Everitt et al.
patent: 3985201 (1976-10-01), Kloster
patent: 4042778 (1977-08-01), Clinton
patent: 4071111 (1978-01-01), Croup
patent: 4109983 (1978-08-01), Kinoshita
patent: 4284168 (1981-08-01), Gaus
patent: 4596305 (1986-06-01), Jagborn
patent: 4811403 (1989-03-01), Henricksen et al.
patent: 4905860 (1990-03-01), Kurihara
patent: 4957184 (1990-09-01), Negishi
patent: 4964482 (1990-10-01), Meyer
patent: 5067583 (1991-11-01), Hathaway
patent: 5168129 (1992-12-01), D'Antonio
Adams Michael
Ritto Ross
Southern California Sound Image, Inc.
Stemmer Daniel
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