Compositions – Electrically conductive or emissive compositions – Free metal containing
Patent
1979-08-31
1981-09-08
Weinblatt, Mayer
Compositions
Electrically conductive or emissive compositions
Free metal containing
252513, 252514, 343911R, 343911L, 343909, 343758, 264 453, 264DIG17, 264DIG10, 264DIG6, 428406, 260375B, 260 37EP, 260 37M, 521 55, H01B 302
Patent
active
042883377
ABSTRACT:
A lightweight mixed dielectric and a manufacturing method thereof is described, which is prepared by mixing metal-coated expanded particles of plastic, glass or silica, thin-wall metal pipes or metal coated thin-wall plastic pipes and uncoated expanded particles of plastic, glass or silica and then forming the resulting mixture into a desired shape by thermal expansion or by the use of binder with the provision that these uncoated expanded particles are only made of plastic when the forming step is carried out by thermal expansion.
REFERENCES:
patent: 2716190 (1955-08-01), Baker
patent: 2883347 (1959-04-01), Fisher et al.
patent: 3079289 (1963-02-01), George et al.
patent: 3088713 (1963-05-01), Gard
patent: 3243483 (1966-03-01), Marshall
patent: 3255453 (1966-06-01), Horst
patent: 3256373 (1966-06-01), Horst
patent: 3470561 (1969-09-01), Horst
patent: 3507940 (1970-04-01), Gard
"Eccospheres.RTM. Hollow Glass and Ceramic Microspheres Microballoons.RTM.", Emerson & Cuming Inc., Canton, Mass., 7-69.
Ota Hiroshi
Sakuma Noboru
Takarabe Takeki
Takiguchi Isao
Tokyo Keiki Company Limited
Weinblatt Mayer
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