Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2004-12-15
2010-02-23
Lee, Jinhee J (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S261000
Reexamination Certificate
active
07667975
ABSTRACT:
A lighting device for a lamp device is provided. The lighting device includes a circuit board and film capacitors packaged on the circuit board by using leadless flow solders. Each film capacitor comprises polypropylene films and lead wires, and a material of the lead wires has a thermal conductivity lower than a thermal conductivity of copper, and terminals and internal materials of the film capacitors are leadless. A diameter of the lead wires is 0.6− (mm) or less, a cross-sectional area is 35 mm2or less, and a temperature at a terminal end of the lead wires in the film capacitors during a soldering process is 130° C. or less.
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Kambara Yasushi
Motoyama Akira
Nakajima Masayuki
J.C. Patents
Lee Jinhee J
Matsushita Electric & Works Ltd.
Semenenko Yuriy
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