Communications: radio wave antennas – Antennas – Microstrip
Patent
1998-09-29
2000-07-18
Wimer, Michael C.
Communications: radio wave antennas
Antennas
Microstrip
343846, H01Q 138
Patent
active
060913673
ABSTRACT:
A flat antenna device is constructed such that circular patches are provided on one surface of a dielectric film, a metallic grounding conductor film is fitted to one surface of a dielectric film, a dielectric member is sandwiched between the dielectric film and the dielectric film, and an extending mechanism is provided to the periphery of the device so as to maintain the dielectric film and the dielectric film in a fully extended state. A circular microstrip patch antenna is formed by the metallic grounding conductor film and each of the circular patches.
REFERENCES:
patent: 4320403 (1982-03-01), Ebneth et al.
patent: 4812854 (1989-03-01), Boan et al.
patent: 4851855 (1989-07-01), Tsukamoto et al.
patent: 4864314 (1989-09-01), Bond
patent: 5218368 (1993-06-01), Huruno et al.
patent: 5430451 (1995-07-01), Kawanishi et al.
Stockton, R.J.; "Large L-Band Radiometer Array", AP-S International Symposium (IEEE), May 15-19, 1978, pp. 446-449.
Murata et al.; "A printed Antenna with Two-Layer Structure for Satellite Broadcast Reception", Electronics and Communications in Japan, Part I, vol. 73, No. 4, pp. 81-90, 1990.
Patent Abstracts of Japan, vol. 009, No. 123 (E-317) May 28, 1985, JP60010806A, Jan. 21, 1985.
Kabashima Shigenori
Konishi Yoshihiko
Ohtsuka Masataka
Ozaki Tsuyoshi
Takahashi Toru
Mitsubishi Denki & Kabushiki Kaisha
Wimer Michael C.
LandOfFree
Light-weight flat antenna device tolerant of temperature variati does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Light-weight flat antenna device tolerant of temperature variati, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Light-weight flat antenna device tolerant of temperature variati will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2041266