Light transmission paste and metallic copper deposition method u

Details Light transmission paste and metallic copper deposition method u Light transmission paste and metallic copper deposition method u

1990-08-17

1992-09-08

Padgett, Marianne

Coating processes

Electrical product produced

Welding electrode

427 96, 427123, 427304, 4274431, B05D 306, B05D 512, B05D 118, B05D 304

Patent

active

051457156

ABSTRACT:
Light transmission paste and a metallic copper deposition method of the present invention can educe metallic copper in the desired portion by applying or contacting light transmission paste on cuprous oxide and applying light upon the desired portion. Also, the light is applied through a mask corresponding to the pattern to be obtained, so that desired circuit pattern may be easily obtained. Further, metallic copper of high density may be educed by the contacting or applying metal deposition paste upon metal of a substrate.

REFERENCES:
patent: 3056881 (1962-10-01), Schwarz
patent: 3347724 (1967-10-01), Schnebler, Jr. et al.
patent: 3451813 (1969-06-01), Kinney et al.
patent: 3671249 (1972-06-01), Flynn
patent: 3928670 (1975-12-01), Brummett et al.
patent: 3993799 (1976-11-01), Feldstein
patent: 4388351 (1983-06-01), Sawyer
patent: 4590115 (1986-05-01), Cassat
patent: 4761303 (1988-08-01), Ruszczyk et al.
patent: 4831210 (1989-05-01), Larson et al.

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